Heatsinks for the FMC Fine Delay
This page summarizes the heatsink testing results.
Fine Delay on SVEC
Test evironment:*
- crate: 20-slot Wiener VME64x
- crate contents: single SVEC in VME slot 5 with the card under test in FMC slot 2 and FMC TDC in FMC slot 1
- fan speed: 1200 RPM (minimum)
- ambient temperature: 20 deg Celsius
- warm-up time: 8 minutes
Results:*
| Serial No | Configuration | Temperature |
| CR37 | no heatsink | 59.7 deg C |
| CR09 | small heatsinks on delay and PLL chips | 51.7 deg C |
| CR01 | big heatsink in the rear of the card | 58.6 deg C |
| CR03 | both heatsinks | 52.3 deg C |
Conclusions:*
- big heatsink gives no temperature drop (1 degC can be considered
measurement error)
- small heatsinks glued on the chips give improvement of 8 degrees C