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  • Heatsink design

Heatsink design

Last edited by Tomasz Wlostowski Sep 23, 2014
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Heatsink Design

NOTE: The heatsink is insufficient for cooling the card on platforms with little or no forced airflow (e.g. a PC with a SPEC). The recommended cooling solution for PCs is an add-on fan for the SPEC card (see SPEC Fan Design).

The heatsink is CNC-machined from a single piece of aluminium. It attaches to the board by replacing the stand-offs next to the FMC connector and by thermoconductive adhesive tape applied to the most heat-dissipating components (i.e. the AD9516 PLL and the SY89285 delay lines) as well as some empty spots on the PCB.

The design (STEP/IGES/DXF formats) is hosted in the repository

3D View:

Top side:

Bottom side:

Assembled mezzanine:

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  • heatsink_3d_view.png
  • heatsink_top.jpg
  • heatsink_bottom.jpg
  • heatsink.jpg
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