- 25 May, 2021 1 commit
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Christos Gentsos authored
Also move some capacitors to the front side.
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- 21 May, 2021 4 commits
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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- 20 May, 2021 2 commits
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Christos Gentsos authored
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Christos Gentsos authored
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- 19 May, 2021 7 commits
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Christos Gentsos authored
Also reduce GND via sharing and generally improve somewhat the FPGA decoupling capacitor placement.
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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- 18 May, 2021 2 commits
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Christos Gentsos authored
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Christos Gentsos authored
Also improved routing for dual-purpose FMC JTAG stubs (see #81).
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- 17 May, 2021 16 commits
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
The rule about small holes (<0.5mm) mistakenly covered all SMD pads, leading to very thin copper connections in thermal reliefs.
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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- 12 May, 2021 1 commit
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Christos Gentsos authored
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- 11 May, 2021 2 commits
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Christos Gentsos authored
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Christos Gentsos authored
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- 06 May, 2021 2 commits
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Christos Gentsos authored
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brecordo authored
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- 24 Nov, 2020 2 commits
- 23 Nov, 2020 1 commit
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billerea authored
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