- 12 Aug, 2022 1 commit
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Alén Arias Vázquez authored
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- 10 Aug, 2022 3 commits
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Alén Arias Vázquez authored
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Alén Arias Vázquez authored
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Alén Arias Vázquez authored
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- 05 Nov, 2021 4 commits
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Christos Gentsos authored
This modification has to be double-checked as: 1. it's not certain that we will reach the front panel, anyway, and 2. there are holes at the board's edge, to be checked if that's allowed in our case.
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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- 09 Jun, 2021 1 commit
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Christos Gentsos authored
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- 01 Jun, 2021 1 commit
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Christos Gentsos authored
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- 31 May, 2021 1 commit
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Christos Gentsos authored
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- 28 May, 2021 1 commit
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Christos Gentsos authored
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- 25 May, 2021 2 commits
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Christos Gentsos authored
Also, improve FPGA decoupling (fit more caps near the pins, reposition others to minimize via sharing, etc)
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Christos Gentsos authored
Also move some capacitors to the front side.
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- 21 May, 2021 4 commits
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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- 20 May, 2021 2 commits
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Christos Gentsos authored
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Christos Gentsos authored
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- 19 May, 2021 7 commits
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Christos Gentsos authored
Also reduce GND via sharing and generally improve somewhat the FPGA decoupling capacitor placement.
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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- 18 May, 2021 2 commits
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Christos Gentsos authored
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Christos Gentsos authored
Also improved routing for dual-purpose FMC JTAG stubs (see #81).
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- 17 May, 2021 11 commits
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
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Christos Gentsos authored
The rule about small holes (<0.5mm) mistakenly covered all SMD pads, leading to very thin copper connections in thermal reliefs.
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Christos Gentsos authored
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