V5 - Solder leaks through non-capped area under ADC component
As the holes in the copper/gold-plated area under the ADC component are not capped and filled, solder is leaking through it.
Visually it is not appealing (see attached file), while it may cause (unlikely though) that the connection between the copper plate under the DAC IC and the PCB may not be made in the best way as solder may have leaked away.
It was suggested by a production company to use Capped and Filled vias in this area. This is actually done on the Fine Delay card too (capped-and-filled under 5 ICs, no solder mask over the areas).
Note that cap-and-fill is very expensive (> 50 CHF/board?) and may well be overkill in this case. A soldermask over the area will fill the holes enough to prevent the solder from leaking through, but may slightly increase the temperature.
See also:
- https://www.ohwr.org/work_packages/459 (ADC)
- https://www.ohwr.org/work_packages/580 (Fine Delay)
