1. 25 Oct, 2012 1 commit
  2. 22 Oct, 2012 1 commit
  3. 19 Oct, 2012 1 commit
  4. 17 Oct, 2012 2 commits
  5. 09 Oct, 2012 2 commits
    • jgabriel's avatar
      The schematics changes performed on the V3.2 are the following: · 27917ddc
      jgabriel authored
      1.- SCB_PLLs: C165 footprint changed to 0402 in order to remove this component and reduce boom.
      2.- Connectors:CN1 Ethernet connector case connected to GND_SHIELD.
      3.- CPU_100M_Ethernet:C206 changed from 470pF to 2,7nF in order to remove this component and reduce boom.Added R253 and R254 resistors (both 75R) between the Tr1 and C214.
      L10 is not mounted now. It connects GND_SHIELD and GND_ETH.
      4.- QDRII_mem and QDRII_power: All the components of the QDRII memories will be not mounted. 
      27917ddc
    • jgabriel's avatar
      Added 75R resistor to wr_switch.SchLib · 485030e4
      jgabriel authored
      485030e4
  6. 13 Jul, 2012 1 commit
  7. 12 Jun, 2012 4 commits
  8. 09 May, 2012 1 commit
  9. 03 May, 2012 3 commits
  10. 16 Apr, 2012 1 commit
  11. 11 Apr, 2012 1 commit
  12. 10 Apr, 2012 2 commits
  13. 04 Apr, 2012 3 commits
  14. 24 Jan, 2012 1 commit
  15. 15 Dec, 2011 1 commit
  16. 13 Dec, 2011 2 commits
  17. 09 Dec, 2011 2 commits
  18. 07 Dec, 2011 3 commits
  19. 02 Dec, 2011 2 commits
  20. 10 Nov, 2011 1 commit
  21. 08 Nov, 2011 1 commit
  22. 07 Nov, 2011 1 commit
  23. 28 Oct, 2011 2 commits
  24. 25 Oct, 2011 1 commit
    • jgabriel's avatar
      Modified footprints of: · 9c137eb6
      jgabriel authored
      -. SFPs
      -. DB-9 Connector
      -. S2M and SK-106 diodes
      -. USB connectors
      PCB Height increased to 1.49mm 
      9c137eb6