Layout Review - 30 January 2015
Present
- Erik Van der Bij
- Tomasz Wlostowski
- Grzegorz Daniluk
- Matthieu Cattin
General comments:
- Reduce nb of power rails?
- Reduce nb of layers to 6.
- Review routing between IC4, TR1 and J2. Avoid stubs!
- Are capped vias really needed?
- Move board cut-out point away from IC11.
- Review ADC 1.8V capacitor placement (C2, C8, C14, C48).
- Remove traces from copper poured area (additional connection to pads).
Silkscreen:
- Change "FmcWorldFIP" to "Fmc-WorldFIP".
- Add a table of speed on top layer
-> Mount a resistor in the corresponding box to show the board's speed. - Remove "-" (dash) after OHL v.1.2.
- Don't use inverter text! ("SYNC", "RX", "TX").
- Move reference point outside component (IC4, TR1).
- Move "EDA-xxxx" text to liberate space for additional sticker(s).
TOP:
- Remove copper fill.
- ADC clock routing can be improved, Use top and bottom (see EDA-02063).
- Move C23 closer to vias (-> check others).
L3:
- Remove copper fingers or completely remove copper fill.
- Use layer for power planes.
- Don't use special width/gap (5.02mils) -> see fmc-adc!
L4:
- +5V not used on the right of the board, replace by another power plane.
L5:
- Better share power planes between L4 and L5.
L6:
- Remove copper fill, or use layer for power planes.
BOTTOM:
- Review J1 (FMC connector) GND connections.
- What are the 5 vias next to IC6 for?
- Remove stub on ADC_CH2 trace.
Mechanics:
- Change "FmcWorldFIP" to "Fmc-WorldFIP".
- Move "EDA-03098" on the other side.
- Move (sync) "ERR" and "ACT" on the side of the LEDs and same size as other ERR/ACT text.
- Move "SYNC" between connector and LEDs
- Change FMC front panel ref in arrangement-mat to: ELMA 21M280-2 (includes 2 spacers + 8 screws).
- Add spacers in arrangement view.
Matthieu Cattin - February 2015