FMC masterFIP
FMC-masterFIP is an interface card for the
WorldFIP network
in an LPC FMC form-factor.
It is used as the physical layer interface of the
masterFIP
project.
Top view of the masterFIP board*
Bottom view of the masterFIP
board
The main components of the FMC-masterFIP board are:
- The FielDrive bus driver and FieldTR insulating transformer, both developed and sold by the company Alstom.
- A Lemo-0 connector, optionally used for the reception of an input synchronization trigger pulse, usually from CERN's timing board CTRI.
- An EEPROM chip, loaded with IPMI FRU information (during PTS testing) so as to comply with the FMC standard.
- A 1-wire thermometer-unique-id-chip.
The schematics of the board, drawn in Altium, are available at CERN's
EDMS. As the following table
shows, three versions of the board have been designed.
A list of issues that were being identified and led to the development
of a new version is available in the issues
tab of this
project.
Different board executions exist depending on the WorldFIP communication
speed: 31.25kbps, 1Mbps, 2.5Mbps, and 5Mbps; a set of ten components
differentiates the board executions.
Specifications
| Parameter | Value |
|---|---|
| Form-factor | FMC, LPC connector |
| WorldFIP connector | Micro Sub-D 9 pins |
| WorldFIP interface | FielDrive + FieldTR (Alstom) |
| Bus speed | 31.25k, 1M, 2.5M, 5M (different executions of hardware) Note that the 5M version is supported by the hw but is has not been tested and is not supported by the current gw/sw/lib |
| External sync. input | Optional sync of the WorldFIP start of macrocycle; LEMO 0 connector; TTL; Software selectable 50 Ohms termination |
| Power Consumption | 200 mA |
| Front panel LEDs |
FMC TX ACT: at the end of a macrocycle there has been no transmission failure FMC TX ERR: at the end of a macrocycle transmission errors have been detected FMC RX ACT: at the end of a macrocycle there has been no reception failure FMC RX ERR: at the end of a macrocycle reception errors have been detected FMC SYNC ACT: application expects sync pulse and it is receiving it successfully FMC SYNC ERR: application expects sync pulse which it is not arriving SPEC GREEN: blinking using the 100 MHz clock SPEC RED: PCIe reset |
| Test points | Four through hole test points (TP) next to the FMC connector: TP1: connected to FielDrive RXD TP2: connected to FielDrive TXD TP3: connected to Mock Turtle led&dbg reg bit 8 TP4: connected to Mock Turtle led&dbg reg bit 9 |
Project information
- Design Guide
- Board EMC Tests
- Board Consumption & Temperature Tests
- Frequently Asked Questions
- Official production documentation (schematics, PCB, etc.):
EDMS: EDA-03098
Currently supported versions:- FmcWorldFIP V4 - Bus speed 31.25k - EDA-03098-V4-0
- FmcWorldFIP V4 - Bus speed 1M - EDA-03098-V4-1
- FmcWorldFIP V4 - Bus speed 2.5M - EDA-03098-V4-2
| Version | Schematics | Comments |
|---|---|---|
| V1 | EDA-03098-V1 -0/1/2/3 | First version |
| V2 | EDA-03098-V2 -0/1/2/3 | Corrections on V1 |
| V3 | EDA-03098-V3 -0/1/2/3 | V2 simplified, without ADC |
| V4 | EDA-03098-V4 -0/1/2/3 | V3 with small modification on the placement of front panel LEDs |
Contacts
Eva Gousiou - CERN | Erik van der Bij - CERN | Matthieu Cattin †, designer - CERN
Project Status
| Date | Event |
|---|---|
| 10-2014 | Schematics work started |
| 12-2014 | Schematics ready for layout |
| 01-2015 | Board layout done at CERN by DEM |
| 01-2015 | Layout review |
| 02-2015 | Layout modification ready |
| 02-2015 | First brainstorm about gateware and firmware |
| 03-2015 | Production files finalised, 3 prototypes ordered |
| 04-2015 | Designer Matthieu Cattin † |
| 04-2015 | 3 assembled prototypes received, 5 empty PCBs available |
| 07-2015 | One board tested that sent and received WorldFIP data. ADC not tested. |
| 02-2016 | Production Test program being written by a company. ADC testing is part of it. |
| 10-2016 | Schematics review for V2 |
| 12-2016 | Layout review for V2 |
| 01-2017 | Hardware V3 ready for production; ADC diagnostics removed based on high production and maintenance costs. |
| 20-01-2017 | Ordered 15 V3 prototype cards. |
| 28-03-2017 | 15 V3 prototype cards received; validated and they are ok! |
| 17-07-2017 | Long runs of V3 boards in the lab and in CHARM |
| 06-09-2017 | Production of 130 v4 masterFIP boards started, to be available by early December 2017 |
| 12-12-2017 | First installation of 51 modules in the LHC |
| 15-02-2018 | Validation of the design in the LHC |
| 16-05-2018 | Reception of 100 v4 masterFIP boards for TS1 installations |
| 15-06-2018 | Installation of 30 more boards in the LHC for Power Converters |
| 13-07-2018 | Reception of 500 v4 masterFIP boards |
| 15-02-2020 | 500 boards being installed in the LHC for different equipment groups like Power-Converters, Quench-Protection, Cryogenics |