FMC masterFIP
FMC-masterFIP is an interface card for the
WorldFIP network
in an LPC FMC form-factor.
It is used as the physical layer interface of the
masterFIP
project.
Top view of the masterFIP board*
Bottom view of the masterFIP
board
The main components of the FMC-masterFIP board are:
- The FielDrive bus driver and FieldTR insulating transformer, both developed and sold by the company Alstom.
- A Lemo-0 connector, optionally used for the reception of an input synchronization trigger pulse, usually from CERN's timing board CTRI.
- An EEPROM chip, loaded with IPMI FRU information (during PTS testing) so as to comply with the FMC standard.
- A 1-wire thermometer-unique-id-chip.
The schematics of the board, drawn in Altium, are available at CERN's
EDMS. As the following table
shows, three versions of the board have been designed.
A list of issues that were being identified and led to the development
of a new version is available in the issues
tab of this
project.
Different board executions exist depending on the WorldFIP communication
speed: 31.25kbps, 1Mbps, 2.5Mbps, and 5Mbps; a set of ten components
differentiates the board executions.
Specifications
Parameter | Value |
Form-factor | FMC, LPC connector |
WorldFIP connector | Micro Sub-D 9 pins |
WorldFIP interface | FielDrive + FieldTR (Alstom) |
Bus speed | 31.25k, 1M, 2.5M, 5M (different executions of hardware) |
External sync. input | Optional sync of the WorldFIP start of macrocycle; LEMO 0 connector; TTL; Software selectable 50 Ohms termination |
Project information
- Official production documentation (schematics, PCB, etc.): EDMS: EDA-03098
- Currently supported versions:
- FmcWorldFIP V3 - Bus speed 31.25k - EDA-03098-V3-0
- FmcWorldFIP V3 - Bus speed 1M - EDA-03098-V3-1
- FmcWorldFIP V3 - Bus speed 2.5M - EDA-03098-V3-2
- FmcWorldFIP V3 - Bus speed 5M - EDA-03098-V3-3
> | Version| Schematics| Comments|
> |V1| EDA-03098-V1-0, EDA-03098-V1-1, EDA-03098-V1-2,
EDA-03098-V1-3| First version|
> |V2| EDA-03098-V2-0, EDA-03098-V2-1, EDA-03098-V2-2,
EDA-03098-V2-3| Corrections on V1|
> |V3| EDA-03098-V3-0, EDA-03098-V3-1, EDA-03098-V3-2,
EDA-03098-V3-3| V2 simplified, without ADC|
- Implementation design guide
- Board EMC tests
- Board Consumption & Temperature tests
- Frequently Asked Questions
Contacts
Eva Gousiou - CERN | Erik van der Bij - CERN | Matthieu Cattin †, designer - CERN
Project Status
Date | Event |
10-2014 | Schematics work started |
12-2014 | Schematics ready for layout |
01-2015 | Board layout done at CERN by DEM |
01-2015 | Layout review |
02-2015 | Layout modification ready |
02-2015 | First brainstorm about gateware and firmware |
03-2015 | Production files finalised, 3 prototypes ordered |
04-2015 | Designer Matthieu Cattin † |
04-2015 | 3 assembled prototypes received, 5 empty PCBs available |
07-2015 | One board tested that sent and received WorldFIP data. ADC not tested. |
02-2016 | Production Test program being written by a company. ADC testing is part of it. |
10-2016 | Schematics review for V2 |
12-2016 | Layout review for V2 |
01-2017 | Hardware V3 ready for production; ADC diagnostics removed based on high production and maintenance costs. |
20-01-2017 | Ordered 15 V3 prototype cards. |
28-03-2017 | 15 V3 prototype cards received; validated and they are ok! |
Matthieu Cattin, Eva Gousiou, Erik van der Bij, 27 April 2017