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# Heatsinks for the FMC Fine Delay
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This page summarizes the heatsink testing results.
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## Fine Delay on SVEC
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*Test evironment:**
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\- crate: 20-slot Wiener VME64x
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\- crate contents: single SVEC in VME slot 5 with the card under test in
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FMC slot 2 and FMC TDC in FMC slot 1
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\- fan speed: 1200 RPM (minimum)
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\- ambient temperature: 20 deg Celsius
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\- warm-up time: 8 minutes
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*Results:**
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| Serial No | Configuration | Temperature |
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| CR37 | no heatsink | 59.7 deg C |
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| CR09 | small heatsinks on delay and PLL chips | 51.7 deg C |
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| CR01 | big heatsink in the rear of the card | 58.6 deg C |
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| CR03 | both heatsinks | 52.3 deg C |
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*Conclusions:**
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\- big heatsink gives no temperature drop (1 degC can be considered
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measurement error)
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\- small heatsinks glued on the chips give improvement of 8 degrees C
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### Files
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* [heatsink.jpg](/uploads/69d938e7701ca5fc20b9150219c462e9/heatsink.jpg)
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* [IR_0180.jpg](/uploads/caf698657e9644df2e29fa4d0d0ae0eb/IR_0180.jpg)
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* [fan.jpg](/uploads/38bd6cc5e31779c41e7adad2c96d2465/fan.jpg) |
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