Commit d072e997 authored by Matthieu Cattin's avatar Matthieu Cattin

hw: Connect gps signal to MCU, modify sd card symbol/footprint to connect case…

hw: Connect gps signal to MCU, modify sd card symbol/footprint to connect case to GND (to avoid floating conductor -> might be bad for GPS reception).
parent fa4bfae0
...@@ -92,10 +92,10 @@ GPS_TXD ...@@ -92,10 +92,10 @@ GPS_TXD
Text GLabel 5750 2450 2 40 Output ~ 0 Text GLabel 5750 2450 2 40 Output ~ 0
GPS_RXD GPS_RXD
Text GLabel 2850 4550 0 40 Output ~ 0 Text GLabel 2850 4550 0 40 Output ~ 0
GPS_STDBY GPS_ON_OFF
Text GLabel 2850 4650 0 40 Output ~ 0 Text GLabel 2850 4650 0 40 Output ~ 0
GPS_RST GPS_RST
Text GLabel 5750 2850 2 40 Input ~ 0 Text GLabel 6300 2850 2 40 Input ~ 0
GPS_PPS GPS_PPS
Text GLabel 2850 4250 0 40 Input ~ 0 Text GLabel 2850 4250 0 40 Input ~ 0
SD_MISO SD_MISO
...@@ -105,8 +105,8 @@ Text GLabel 2850 4350 0 40 Output ~ 0 ...@@ -105,8 +105,8 @@ Text GLabel 2850 4350 0 40 Output ~ 0
SD_CLK SD_CLK
Text GLabel 2850 4450 0 40 Output ~ 0 Text GLabel 2850 4450 0 40 Output ~ 0
SD_CS_N SD_CS_N
Text GLabel 2850 4750 0 40 Output ~ 0 Text GLabel 2850 4750 0 40 Input ~ 0
GPS_EN GPS_WAKUP
Text GLabel 5750 4450 2 40 BiDi ~ 0 Text GLabel 5750 4450 2 40 BiDi ~ 0
USB_DP USB_DP
Text GLabel 5750 4350 2 40 BiDi ~ 0 Text GLabel 5750 4350 2 40 BiDi ~ 0
......
...@@ -50,8 +50,8 @@ ...@@ -50,8 +50,8 @@
(pad 3 smd rect (at 0.97 0) (size 0.6 1.05) (layers F.Cu F.Paste F.Mask)) (pad 3 smd rect (at 0.97 0) (size 0.6 1.05) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at 2.07 0) (size 0.6 1.05) (layers F.Cu F.Paste F.Mask)) (pad 2 smd rect (at 2.07 0) (size 0.6 1.05) (layers F.Cu F.Paste F.Mask))
(pad 1 smd rect (at 3.17 0) (size 0.6 1.05) (layers F.Cu F.Paste F.Mask)) (pad 1 smd rect (at 3.17 0) (size 0.6 1.05) (layers F.Cu F.Paste F.Mask))
(pad "" smd rect (at 6.725 2.53) (size 1.05 1.5) (layers F.Cu F.Paste F.Mask)) (pad 9 smd rect (at 6.725 2.53) (size 1.05 1.5) (layers F.Cu F.Paste F.Mask))
(pad "" smd rect (at 6.725 -5.87) (size 1.05 1.5) (layers F.Cu F.Paste F.Mask)) (pad 9 smd rect (at 6.725 -5.87) (size 1.05 1.5) (layers F.Cu F.Paste F.Mask))
(pad "" smd rect (at -6.725 -5.87) (size 1.05 1.5) (layers F.Cu F.Paste F.Mask)) (pad 9 smd rect (at -6.725 -5.87) (size 1.05 1.5) (layers F.Cu F.Paste F.Mask))
(pad "" smd rect (at -6.725 2.53) (size 1.05 1.5) (layers F.Cu F.Paste F.Mask)) (pad 9 smd rect (at -6.725 2.53) (size 1.05 1.5) (layers F.Cu F.Paste F.Mask))
) )
...@@ -430,11 +430,11 @@ ENDDEF ...@@ -430,11 +430,11 @@ ENDDEF
# #
DEF MICRO_SDCARD_SPI U 0 40 Y Y 1 F N DEF MICRO_SDCARD_SPI U 0 40 Y Y 1 F N
F0 "U" 550 150 60 H V C CNN F0 "U" 550 150 60 H V C CNN
F1 "MICRO_SDCARD_SPI" 450 -850 60 H V C CNN F1 "MICRO_SDCARD_SPI" 450 -950 60 H V C CNN
F2 "" 0 0 60 H V C CNN F2 "" 0 0 60 H V C CNN
F3 "" 0 0 60 H V C CNN F3 "" 0 0 60 H V C CNN
DRAW DRAW
S 300 100 750 -800 0 1 0 N S 300 100 750 -900 0 1 0 N
X NC 1 0 0 300 R 50 50 1 1 N X NC 1 0 0 300 R 50 50 1 1 N
X CS 2 0 -100 300 R 50 50 1 1 I I X CS 2 0 -100 300 R 50 50 1 1 I I
X DI 3 0 -200 300 R 50 50 1 1 I X DI 3 0 -200 300 R 50 50 1 1 I
...@@ -443,6 +443,7 @@ X CLK 5 0 -400 300 R 50 50 1 1 I ...@@ -443,6 +443,7 @@ X CLK 5 0 -400 300 R 50 50 1 1 I
X VSS 6 0 -500 300 R 50 50 1 1 W X VSS 6 0 -500 300 R 50 50 1 1 W
X DO 7 0 -600 300 R 50 50 1 1 O X DO 7 0 -600 300 R 50 50 1 1 O
X RSV 8 0 -700 300 R 50 50 1 1 N X RSV 8 0 -700 300 R 50 50 1 1 N
X CASE 9 0 -800 300 R 50 50 1 1 U
ENDDRAW ENDDRAW
ENDDEF ENDDEF
# #
......
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