Distributed IO Tier
Project description
Distributed I/O Tier - is the level where electronics modules installed
close to a particle accelerator in radiation-exposed or radiation-free
areas controlled by the master in the Front-end tier over the
fieldbus.
These are usually FPGA-based boards sampling digital and analog inputs,
driving outputs and performing various safety critical
operations.
Modular and reusable Distributed I/O Tier hardware kit*
Project information
Modules
Main Kit:
The DI/OT Main Kit provides the following modules which are essential to the DI/OT system and application-independent:
-
DI/OT 3U crate
Backplanes and crate mechanics designs; the crate is the same for radiation-free and radiation-exposed areas -
RaToPUS
100W AC/DC power supply for radiation tolerant DI/OT crate; an off-the-shelf power supply at higher capacity may be used outside of radiation -
MoniMod
General-purpose, small form factor monitoring module for RaToPUS and 1U fan tray in radiation-exposed areas -
DI/OT System Board with ZU7
A non-radiation-tolerant crate controller with Zynq Ultrascale MPSoC, White Rabbit support and Low Pin Count FMC -
DI/OT Rad-tol System Board with Igloo2
A radiation-tolerant crate controller with Flash-based Igloo2 FPGA -
Communication mezzanines
A set of FMC mezzanine boards that support different communication protocols: White Rabbit and Profinet for radiation-free areas, Powerlink and WorldFIP for the radiation-exposed ones
Peripheral Boards:
The Peripheral Boards are application-specific. The DI/OT kit provides a generic SoC-based FMC-carrier Peripheral Board; the application-specific hardware is placed on the FMC-mezzanine and the software/gateware runs on the carrier SoC.
-
DI/OT FMC carrier Peripheral Board
DI/OT FMC carrier
A digital I/O module with sixteen 24 Volt optically isolated inputs and outputs has is also available for the CERN Warm Interlocks System.
-
DIOT_DIO_16ch_opt_24V
Sixteen-channel digital I/O Peripheral Board
Documents
- DIOT System Specification draft
- DIOT project on CERN BE-CO wikis (CERN access only)
- Frequently Asked Questions
Papers and presentations
Low-Cost Modular Platform for Custom Electronics in Radiation-Exposed and Radiation-Free Areas at CERN
paper slides
G.Daniluk, C.Gentsos, E.Gousiou, L.Patnaik, M.Rizzi, Proceedings of ICALEPCS2019, New York, USA
Plans at CERN for electronics and communication in the Distributed I/O
Tier
G.Daniluk E.Gousiou, Proceedings of ICALEPCS2017, Barcelona, Spain,
ISBN: 9783954501939
Contacts
- Greg Daniluk - CERN
Status
| Date | Event |
|---|---|
| 10-01-20 | Created FAQ |
| 1-05-20 | First version of crate mechanics and backplanes design finalized, awaiting the prototypes |
