Distributed IO Tier
Project description
Distributed I/O Tier - is the level where electronics modules installed
close to a particle accelerator in radiation-exposed or radiation-free
areas controlled by the master in the Front-end tier over the
fieldbus.
These are usually FPGA-based boards sampling digital and analog inputs,
driving outputs and performing various safety critical
operations.
Modular and reusable Distributed I/O Tier hardware kit*
Project information
Modules
Main Kit:
The DI/OT Main Kit provides the following modules which are essential to the DI/OT system and application-independent:
-
DI/OT 3U crate
Backplanes and crate mechanics designs; the crate is the same for radiation-free and radiation-exposed areas -
RaToPUS
100W AC/DC power supply for radiation tolerant DI/OT crate; an off-the-shelf power supply at higher capacity may be used outside of radiation -
MoniMod
General-purpose, small form factor monitoring module for RaToPUS and 1U fan tray in radiation-exposed areas -
DI/OT System Board with ZU7
A non-radiation-tolerant crate controller with Zynq Ultrascale MPSoC, White Rabbit support and Low Pin Count FMC -
DI/OT Rad-tol System Board with Igloo2
A radiation-tolerant crate controller with Flash-based Igloo2 FPGA -
Communication mezzanines
A set of FMC mezzanine boards that support different communication protocols: White Rabbit and Profinet for radiation-free areas, Powerlink and WorldFIP for the radiation-exposed ones -
Hydra
Hydra is a radiation-tolerant SoC designed to operate up to 500 Gy TID. It features a RISC-V CPU running at 50 MHz, 96 kB of ROM for code, 64 kB of RAM, two Ethernet NIC with low-latency L2 packet switching, SPI and watchdog. Its first use is in the implementation of a Powerlink node using a stripped-down OpenPowerlink stack.
Peripheral Boards:
The Peripheral Boards are application-specific. The DI/OT kit provides a generic SoC-based FMC-carrier Peripheral Board; the application-specific hardware is placed on the FMC-mezzanine and the software/gateware runs on the carrier SoC.
-
DI/OT FMC carrier Peripheral Board
DI/OT FMC carrier -
DIOT_DIO_16ch_opt_24V
A digital I/O module with sixteen 24 Volt optically isolated inputs and outputs has is also available for the CERN Warm Interlocks System.
Reliability/Dependability Studies
Documents
- DI/OT System Specification
- DI/OT project CERN internal collaborations (CERN access only)
- Frequently Asked Questions
Presentations
2021
Radiation-tolerant DI/OT developments (Introduction, RaToPUS, System Board, Reliability)
CERN R2E Annual Meeting, 3 Feb 2021
2020
DI/OT developments overview for CERN Cryogenics group
G.Daniluk, J.Serrano, 11 Dec 2020
DI/OT platform: development status and interfaces with CO services (video - CERN access only)
G.Daniluk, E.Gousiou, CERN Technical Meeting, 4 Jun 2020
Papers
Design of a 100W Radiation-Tolerant Power-Factor-Correction Buck AC/DC Converter
paper
Lalit Patnaik, Grzegorz Daniluk, Salvatore Danzeca, PCIM Europe digital days 2020
Low-Cost Modular Platform for Custom Electronics in Radiation-Exposed and Radiation-Free Areas at CERN
paper slides
G.Daniluk, C.Gentsos, E.Gousiou, L.Patnaik, M.Rizzi, Proceedings of ICALEPCS2019, New York, USA
Plans at CERN for electronics and communication in the Distributed I/O
Tier
G.Daniluk E.Gousiou, Proceedings of ICALEPCS2017, Barcelona, Spain,
ISBN: 9783954501939
Contacts
- Greg Daniluk - CERN
Status
| Date | Event |
|---|---|
| 2015 | Start of the project at CERN as collaboration to design generic hardware platform for accelerator equipment |
| 2017 | DI/OT becomes official work package of HL-LHC project |
| 10-01-20 | Created FAQ |
| 01-05-20 | First version of crate mechanics and backplanes design finalized, awaiting the prototypes |
| 11-09-20 | Non-radiation-tolerant System Board design finalized, awaiting the prototypes |
| 03-12-20 | First prototypes of DI/OT crate and backplanes received! |
| 31-03-21 | First prototypes of Non-rad-tol System Board received |
