... | ... | @@ -5,7 +5,9 @@ getting quite hot in installations. This page summarizes the Fine Delay |
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heating problems and proposes solutions to mitigate them:
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- fit a heatsink
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- increase air flow (fan speed) to improve heat transfer
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- fit a fan
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- increase air flow in the crate/PC (fan speed) to improve heat
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transfer
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- replace LVPECL delay lines with low-power LVDS equivalents
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## Detailed temperature measurements on different platforms
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... | ... | @@ -285,6 +287,10 @@ need to recommend to not use slot 6. |
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### Data (with heatsinks)
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All FMCs were fitted with a custom CNC-machined heatsink (see photo
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below):
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![](/uploads/9b2c51715dde3909ca7efc8f1923a9a0/heatsink.jpg)
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*Wiener 21-slot VME64x crate, slots 4-9:**
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<table>
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... | ... | @@ -729,6 +735,18 @@ use the new chip, for production purposes a new revision of the PCB |
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should be made. Also, the new LVDS delay line is much harder to obtain
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than the PECL version.
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## Fitting a fan on SPEC/Kontron PCs
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We tried fitting a small fan below the FMC in the cutout on the SPEC
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card. The fan is installed on a mechanical support made from FR4 and
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attached to the board using the FMC's mounting screws (see photos
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below):
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*Kontron with FMC fans**
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| **Fan direction** | **Slot:** | 1 | 2 | 3 |
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| blowing | **Temp:** | 58.62 | 72.19 | 77.50 |
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| exhaust | | 65.62 | 63.69 | 64.62 |
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## Conclusions
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*What to do:**
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