EMC2-DP - PC/104 OneBank Carrier for SoC Modules.
Project description
The EMC2-DP is a PCIe/104 OneBank Carrier for a Trenz compatible SoC
Module and has expansion for a VITA57.1 FMC LPC I/O board and also has
I/O pins, using a 100-way Samtec RazorBeam connectors system.
The add-on board, called “Sundance External Interface Connector – SEIC”
contains LEDs, RS232, USB2.0, HDMI, 1Gb Ethernet and SATA. The “SEIC”
can be customized for individual applications and bespoke connectors.
The PCIe/104 OneBank design enables the EMC2-DP to be added to robust and rugged installations.
This development is made under the EU TULIPP project.
EMC2-DP production board*
Main Features
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PCIe/104 OneBank Carrier for Trenz 4x5cm SoC Modules
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PCI Express Gen 2 compatible and integrate PCI Express switch
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Infinite number of EMC2-DP can be stacked for large I/O solutions
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Expandable with any VITA57.1 FMC I/O Module for more flexibility
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96 mm x 90 mm PC/104 Form-Factor with Cable-less Break-Out PCB Connector
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8 electrical layers PCB
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Licensed under CERN OHL v.1.2
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Development made under the EU Artemis EMC2 project
Project information
- Block diagram (.pdf)
- Design Specification (.pdf)
- Starter Guide (.pdf)
- Pinout Compatibilities
- Board IO (.pdf)
- Master pinout (.xlsx)
- Trenz pinout Viewer/XDC-Generator (.xlsm)
Hardware
- Schematics (created with
OrCAD)
- Schematics (.pdf)
- Source files
- PCB (created with Zuken)
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All layers (.pdf)
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- Other
Software
- Demonstration examples
- HDMI Output Test example SDSoC Platform (16.2) for z7030.
- HDMI Loopback Test example
Contacts
Commercial producers
General question about project
Status
| Date | Event |
|---|---|
| 25-10-2013 | First draft |
| 19-06-2015 | V1 schematic finished |
| 06-10-2015 | First batch of V1 has been built |
| 16-02-2016 | V2 schematic issued |
| 29-04-2016 | First batch of V2 has been built |
| 11-05-2017 | Project added to ohwr.org |
19 May 2017