Both W1 and W2 (including SW1) do not have to be mounted during normal production runs. So should be marked as not mounted in the schematic.
The W2 jumper was added because of #54 (closed). Documentation could be added to the schematic. SW1 should not be part of the schematic, as it should only be used when needed during testing.
Regarding the update of the document, I don't mind changing it and add the sticker placement description. Or do you want to do this your self?
Hello @FedericoVaga,
The document which is available in the open hardware repository wiki page seems to be outdated. Based on #59 (closed) the document was changes regarding to copyrights, and is now available on https://edms.cern.ch/ui/#!master/navigator/document?P:101005286:101176022:subDocs, including the source document.
W1 is according to EDA-04509-V1-0_pcb-mat.xls a HARWIN M20-9990246 (2 Contacts SIL Vertical Pin Header, Pitch 2.54mm, Mating Height 6.1mm, Insulator 2.54mm, Finish Tin).
W2 is according to EDA-04509-V1-0_pcb-mat.xls a SAMTEC MTLW-102-07-L-S-250 (2 Contacts, Pitch 2.54mm, Single Row Through Mount Straight Header (Post Lead = 6.35mm, Tail Lead 3.05mm, Insulator 1.52mm))
W2 should be the HARWIN M20-9990246 also, as it is the same type of connector.
The Infineon IRF9910TRPBF is no longer manufactured. During the latest production process the IRF9910TRPBF was still available. According to Digikey the manufacturer recommends the IRF8910TRPBF as a substitute.
SW1 (Stelvio-Kontakt 313170000402) should not be on the BoM and noted as 'Not Mounted'.
OnSemi NC7SZ125M5X is no longer manufactured. This is part IC1, IC2, IC3, IC5, IC6, IC7, IC9, IC11, IC12, IC15 and IC16. It is replaced during production by the Texas Instruments SN74LVC1G125DBV.
Placement of the HCCXUBA and HCCXUCA stickers is not part of the assembly document
Wrong dimension of cutout in lower right corner, resulting in inoperability of the locking handle.
Distance as shown above was changed from 61.8 to 60.8 in order to create more space for the locking handle. Production of the five V0.4 prototypes was carried out according the corrected dimensions. Somehow this incorrect dimension found its way back into the EDA-04509-V1-0_fp drawings. Corrective action: Make sure corrected dimensions are saved in revised drawings (pdf and dwg).
The Wiki (https://ohwr.org/project/pxie-ctl-comexpress-tst/wikis/home) doesn't point to the PTS 1.1 short form.
The PTS v1.1 document https://ohwr.org/project/pxie-ctl-comexpress-tst/wikis/uploads/2210e7cbbe7d91816451d86347283abc/PXIeCOMe_production_test_procedure_v1.1.pdf is lacking the login username and password, which is mentioned in PTS v1.0 short document: https://ohwr.org/project/pxie-ctl-comexpress-tst/blob/master/pts/test/pxiecome/doc/PXIeCOMe_production_test_procedure_v1.0_short.pdf
The PTS in the Repository is an old version, and also without the v1.1 documentation and short form.
The docx and pdf were send to the design office (9 Nov 2022) but changed and uploaded to EDMS. The requested CC-BY-SA 4.0 was replaced by the OHL disclaimer. Because this change caused the document to be near unreadable at many locations, I requested to remove the document from EDMS, and asked to provide us with the complete license text which should be used for this document. So CC-BY-SA 4.0 and OHL disclaimers, or what is required. This so I can change the docx and create a readable pdf.
Okay, thank you. We looked at the Assembly Data, but didn't see the documents on page 2.
The EDA04509-V1-0_assy.zip file is missing, which ought to contain the the ODB++ files which is needed for the assembly of the board.
Please remove both EDA-04509-V1-0_Assembly-Instruction.docx and EDA-04509-V1-0_Assembly-Instruction.pdf from the Assembly Data of the EDA-04509-V1-0 on EDMS. The current docx and pdf are at many locations near unreadable and do not uphold the standard of our way of documentation. The request was to add the CC-BY-SA 4.0 license text, but now it contains an image of CERN-OHL-W-2.0+ license text without the CC-BY-SA 4.0. Please provide us with the complete license text which should be used for this document, so I can change the docx and create a readable pdf.
Btw, why should the docx be placed on EDMS and not just on the OHWR?
The design of EDA04510-V1-0_misc1 is such that the 10mm thick sheet/plate should be cut/milled to a 85x27x10mm piece. The holes and pockets should be created from one side as shown in the CUT A-A of the pdf. FR4 of that thickness is usually manufactured by a lamination process so the FR4 plate consists of many layers. Drilling and milling into this 10mm thick side could delaminate the plate. Or is there enough experience with this process? Could you send us a sample of such a 10mm thick FR4 plate?
Where can sheets of 10mm thick FR4 be bought? Can this be machined so threaded holes can be added?