DIOT - Distributed IO Tier
The Distributed I/O Tier (DI/OT) project was launched to develop a common, modular hardware platform for custom electronics at the lowest layer of the CERN control system. Traditionally, this layer—closest to the accelerator and often exposed to radiation—relied on highly specialized, custom-designed devices with little reusability across subsystems. DI/OT addresses this limitation with a 3U crate based on the CompactPCI Serial industrial standard, along with high- performance (non-radiation-tolerant) and radiation-tolerant (lower-performance) modules. Key components include two System Boards (featuring Igloo2 FPGA and AMD Zynq UltraScale+ MPSoC), a radiation-tolerant switched-mode power supply, a fan tray, an FMC WorldFIP module, and a radiation-tolerant RISC-V soft-core. DI/OT users can tailor the platform to their needs by designing application-specific Peripheral Boards, FPGA configurations, and low-level soft- ware for the System Board. Standardizing on a common platform enables different equipment groups to benefit from centrally supported hardware while facilitating the sharing of application-specific peripherals.
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Modular and reusable Distributed I/O Tier hardware kit