Commit 7aa17364 authored by unknown's avatar unknown

adding AMC revB sources

parent 18cf4b2a
#############################################################################################
Change list of the FTRN-AMC REVB PCB compared to the REVA PCB from 2016-07-26
Only mechanical changes are described here.
-------------------------------------------------------------------------------
- moved C100 and DIP1 switch towards board center, away from JTAG1 connector
- fixed backplane connector outline (corners), as on Figure 2-12,
DETAIL A, PICMG AMC.0 R2.0 specification document
- fixed backplane connector pins/pads (pin second/third/last mate),
as on Figure 2-13 PICMG AMC.0 R2.0 specification document
- changed board outline: added notches in the backplane connector
"PCB edge implementation specific area"
- added text near DIP1 switch to describe DIP switch functionality
- added OHWR license text and web link to the silk
- added CE, ROHS symbols
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G04 ================== begin FILE IDENTIFICATION RECORD ==================*
G04 Layout Name: C:/___PCB_SCH/External/CosyLab/AMC/B/FTRN_AMC_REVB.brd*
G04 Film Name: Milling*
G04 File Format: Gerber RS274X*
G04 File Origin: Cadence Allegro 16.6-2015-S051*
G04 Origin Date: Mon Feb 26 16:38:10 2018*
G04 *
G04 Layer: BOARD GEOMETRY/OUTLINE*
G04 *
G04 Offset: (0.0000 0.0000)*
G04 Mirror: No*
G04 Mode: Positive*
G04 Rotation: 0*
G04 FullContactRelief: No*
G04 UndefLineWidth: 0.0000*
G04 ================== end FILE IDENTIFICATION RECORD ====================*
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M02*
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#############################################################################################
Change list on the FTRN-AMC REVB schematic compared to the REVA schematic from 2016-07-26
-------------------------------------------------------------------------------
Page 04:
- DZ2 replaced with lower package variant
- changed PRESENT_V12AUX circuit: DZ5 replaced with lower package variant,
removed DZ3, added POWAP1 3.3V voltage regulator, R150 value to 1k
-------------------------------------------------------------------------------
Page 05:
- added R17, R18 on the POWVLC5, POWVLC9 outputs as minimal load for LDOs
- Caps C58,C72,C80,C261,C272,C274 replaced with lower package variant
-------------------------------------------------------------------------------
Page 06:
- R193,R194 marked as DNP
- added R74 pull-down on nCONFIG_PROG, added R92 pull-up on nCONFIG,
added R192 pull-up on #MMC_FPGA_CONFIG
-------------------------------------------------------------------------------
Page 07:
- changed values of R115,R111,R112,R114,R119,R116 and led values/colors
of D26,D28,D30,D31,D27,D29
- USBCON1 shield pins connected to FACE_PLATE
-------------------------------------------------------------------------------
Page 08:
- Caps C289,C306,C309,C310,326,C337 replaced with lower package variant
-------------------------------------------------------------------------------
Page 09:
- added AC-coupling caps C357,C358 on PCIe RX
-------------------------------------------------------------------------------
Page 13:
- Caps C395,C396,C410 replaced with lower package variant
- changed value of current limit resistor R1095 to 220R; added 1K5 R1096,
to set current limit of PMX1 to max ~148mA
- added C20, C21 to the PMC1 inputs
- replaced JTAG1 connector with the one with keying to ensure proper connection
of the JTAG cable
- MMC1A P1.19: removed MMC_ULED_0 (R96, DU1); connected PRESENT_V12AUX to P1.19
- MMC1A P1.26: renamed to JTRCK_MMC, connected to pin7 of the JTAG1 via R1036;
added pull-down R1228
- added R304 pull-up and Q11 for driving HotSwap LED (same as on DENX
reference board)
- led D33 changed to green; D20 changed to red; swapped values for R301,R302
- IC1 (FT230XQ) power source changed to USB 5V; added L22 and C374
on the USB 5V rail; removed C374;C380 to V33_USB rail; removed R162,R163;
added IC4,C362,R169 to buffer RX line towards MMC;
added IC5,C364,R170 to buffer TX line towards FTDI;
optional R162,R163 instead of IC4,IC5
- USBCON2 shield pins connected to FACE_PLATE
-------------------------------------------------------------------------------
Page 14:
- MMC_I2C_SDA connected via R121 to DIP1 switch (option to boot MMC bootloader)
-------------------------------------------------------------------------------
Page 15:
- R1108 pull-down replaced with 2K on LIB_TRIG_EN as stronger pull-down
to overcome 20k FPGA pull-up during FPGA boot
-------------------------------------------------------------------------------
Page 16:
- added pull-down R359 to #MLVDIO_PDN to overcome 20k FPGA pull-up during
FPGA boot
-------------------------------------------------------------------------------
Page 17:
- added pull-down R360,R361,R362,R363 to HSS_TX_EN_x to overcome 20k FPGA
pull-up during FPGA boot
-------------------------------------------------------------------------------
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(BuildFileAddedOrDeleted "x")
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