Handling of the comments after the layout review
General Comments
- Change the name of the library. Folder names starting with "." will
be hidden in a Linux environment.
- Done.
- Change the 3D model path in the project. The relative path can be
set by adding
${KIPRJMOD}
to make a reference to your project. For example :C/xxx/xxx/KicadProject/3DModel/transformer.wrl
=>${KIPRJMOD}/3DModel/transformer.wrl
.- Done.
Comments about the layout
- Add a 0 ohm resistor on the differential input lines to avoid
creating a stub.
- Done.
- Make the link between the SMD SMA and the input lines sooner in
order to reduce the line attenuation.
- Done. As the SMD SMA components are not easy to find, we rather chose through holes components.
- Remove vias near through-holes: they are not necessary.
- Done.
- Do not forget to add vias near the decoupling components ! You
forget it for R9.
- Done.
- Put the connector lines on the top layer instead of the bottom
layer. Less vias means less perturbation of the signal.
- Done.
- Avoid overlapping the power supply planes. They are a bit
overlapping under the ADC.
- Done.
- Enable thermal pad everywhere (easier to solder).
- Done.
- Route the 5 V on the top layer to avoid splitting the 3 V plane.
- Done.
- For the FCI connectors, it would be cleaner if you put the line vias
once on one side of the connector once on the other side.
- Done for the connector lines (the lines linking the external connectors to the FCI).
- Move the clock circuitry to keep it as separate as possible from the
Microzed.
- The Microzed is oriented to keep the noisy parts as far as possible from the analog part. Moving the analog circuitry would be a complete change of orientation. After discussion with Mattia Rizzi, the actual configuration would not be a big problem.
- Remove the silkscreen on the through holes.
- Done.
- Pay attention to the solder paste on the big footprint. If you put
too much paste, the component can bend during soldering. You should
divide the big pads into smaller ones. These small pads are filled
with solder paste.
- Done.
Nicolas Boucquey 02-08-2016