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fmc-nanofip
Commit 7d715719 authored by Christos Gentsos's avatar Christos Gentsos
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Change SMD pad test points to plated holes (related to #3)

parent 157703c3
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EDA-03613-V3-1-cache.lib
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......@@ -1659,15 +1659,15 @@ P 2 0 1 0 0 60 0 -60 N
ENDDRAW
ENDDEF
#
# Pads_PLATED_HOLE2.7_PAD5.0
# Pads_PLATED_HOLE0.6_PAD1.3
#
DEF Pads_PLATED_HOLE2.7_PAD5.0 B 0 50 Y Y 1 L N
DEF Pads_PLATED_HOLE0.6_PAD1.3 B 0 50 Y Y 1 L N
F0 "B" -50 0 50 H V R CNN
F1 "Pads_PLATED_HOLE2.7_PAD5.0" 0 -155 50 H I L CNN
F2 "Pads:MTG270_500" 0 -230 50 H I L CNN
F1 "Pads_PLATED_HOLE0.6_PAD1.3" 0 -155 50 H I L CNN
F2 "Pads:c130h60" 0 -230 50 H I L CNN
F3 "Undefined" 0 -305 50 H I L CNN
F4 "Plated Hole" 0 0 50 H I C CNN "Family"
F5 "PLATED_HOLE2.7_PAD5.0" 0 -380 50 H I L CNN "Part Number"
F5 "PLATED_HOLE0.6_PAD1.3" 0 -380 50 H I L CNN "Part Number"
F6 "Single Terminal Socket" 0 -455 50 H I L CNN "Library Ref"
F7 "SchLib\\Pads.SchLib" 0 -530 50 H I L CNN "Library Path"
F8 " " 0 -605 50 H I L CNN "Comment"
......@@ -1676,7 +1676,7 @@ F10 "Standard (No BOM)" 0 -755 50 H I L CNN "Component Type"
F11 "1" 0 -830 50 H I L CNN "Pin Count"
F12 " " 0 -905 50 H I L CNN "Case"
F13 "PcbLib\\Pads.PcbLib" 0 -980 50 H I L CNN "Footprint Path"
F14 "MTG270_500" 0 -1055 50 H I L CNN "Footprint Ref"
F14 "c130h60" 0 -1055 50 H I L CNN "Footprint Ref"
F15 "Plated Hole" 0 -1130 50 H I L CNN "Family"
F16 "No" 0 -1205 50 H I L CNN "Mounted"
F17 "No" 0 -1280 50 H I L CNN "Socket"
......@@ -1686,7 +1686,7 @@ F20 " " 0 -1505 50 H I L CNN "Sense Comment"
F21 "None" 0 -1580 50 H I L CNN "Status"
F22 " " 0 -1655 50 H I L CNN "Status Comment"
F23 " " 0 -1730 50 H I L CNN "SCEM"
F24 "Plated Through Hole: Hole Dia.=2.7mm Pad Dia.=5.0mm" 0 -1805 50 H I L CNN "Part Description"
F24 "Plated Through Hole: Hole Dia.=0.6mm Pad Dia.=1.3mm" 0 -1805 50 H I L CNN "Part Description"
F25 " " 0 -1880 50 H I L CNN "Manufacturer"
F26 " " 0 -1955 50 H I L CNN "Manufacturer Part Number"
F27 "0mm" 0 -2030 50 H I L CNN "ComponentHeight"
......@@ -1698,10 +1698,10 @@ F32 " " 0 -2405 50 H I L CNN "ComponentLink1URL"
F33 " " 0 -2480 50 H I L CNN "ComponentLink1Description"
F34 " " 0 -2555 50 H I L CNN "ComponentLink2URL"
F35 " " 0 -2630 50 H I L CNN "ComponentLink2Description"
F36 "CERN DEM JMW" 0 -2705 50 H I L CNN "Author"
F37 "09/27/11 00:00:00" 0 -2780 50 H I L CNN "CreateDate"
F38 "09/27/11 00:00:00" 0 -2855 50 H I L CNN "LatestRevisionDate"
F39 "Plated Through Hole: Hole Dia.=2.7mm Pad Dia.=5.0mm" 0 -2930 50 H I L CNN "PackageDescription"
F36 "CERN DEM MR" 0 -2705 50 H I L CNN "Author"
F37 "03/02/16 00:00:00" 0 -2780 50 H I L CNN "CreateDate"
F38 "03/02/16 00:00:00" 0 -2855 50 H I L CNN "LatestRevisionDate"
F39 "Plated Through Hole: Hole Dia.=0.6mm Pad Dia.=1.3mm" 0 -2930 50 H I L CNN "PackageDescription"
F40 "Eletro-mechanical" 0 -3005 50 H I L CNN "Database Table Name"
F41 "Pads" 0 -3080 50 H I L CNN "Library Name"
F42 "Pads" 0 -3155 50 H I L CNN "Footprint Library"
......@@ -1712,16 +1712,16 @@ X 1 1 0 0 0 L 0 0 0 1 B
ENDDRAW
ENDDEF
#
# Pads_SMD_PAD_1.27X1.27MM
# Pads_PLATED_HOLE2.7_PAD5.0
#
DEF Pads_SMD_PAD_1.27X1.27MM TP 0 50 Y Y 1 L N
F0 "TP" -50 0 50 H V R CNN
F1 "Pads_SMD_PAD_1.27X1.27MM" 0 -155 50 H I L CNN
F2 "Pads:TPS127" 0 -230 50 H I L CNN
DEF Pads_PLATED_HOLE2.7_PAD5.0 B 0 50 Y Y 1 L N
F0 "B" -50 0 50 H V R CNN
F1 "Pads_PLATED_HOLE2.7_PAD5.0" 0 -155 50 H I L CNN
F2 "Pads:MTG270_500" 0 -230 50 H I L CNN
F3 "Undefined" 0 -305 50 H I L CNN
F4 "Test Point" 0 0 50 H I C CNN "Family"
F5 "SMD_PAD_1.27X1.27MM" 0 -380 50 H I L CNN "Part Number"
F6 "Test Point" 0 -455 50 H I L CNN "Library Ref"
F4 "Plated Hole" 0 0 50 H I C CNN "Family"
F5 "PLATED_HOLE2.7_PAD5.0" 0 -380 50 H I L CNN "Part Number"
F6 "Single Terminal Socket" 0 -455 50 H I L CNN "Library Ref"
F7 "SchLib\\Pads.SchLib" 0 -530 50 H I L CNN "Library Path"
F8 " " 0 -605 50 H I L CNN "Comment"
F9 "Standard (No BOM)" 0 -680 50 H I L CNN "Component Kind"
......@@ -1729,8 +1729,8 @@ F10 "Standard (No BOM)" 0 -755 50 H I L CNN "Component Type"
F11 "1" 0 -830 50 H I L CNN "Pin Count"
F12 " " 0 -905 50 H I L CNN "Case"
F13 "PcbLib\\Pads.PcbLib" 0 -980 50 H I L CNN "Footprint Path"
F14 "TPS127" 0 -1055 50 H I L CNN "Footprint Ref"
F15 "Test Point" 0 -1130 50 H I L CNN "Family"
F14 "MTG270_500" 0 -1055 50 H I L CNN "Footprint Ref"
F15 "Plated Hole" 0 -1130 50 H I L CNN "Family"
F16 "No" 0 -1205 50 H I L CNN "Mounted"
F17 "No" 0 -1280 50 H I L CNN "Socket"
F18 "No" 0 -1355 50 H I L CNN "SMD"
......@@ -1739,7 +1739,7 @@ F20 " " 0 -1505 50 H I L CNN "Sense Comment"
F21 "None" 0 -1580 50 H I L CNN "Status"
F22 " " 0 -1655 50 H I L CNN "Status Comment"
F23 " " 0 -1730 50 H I L CNN "SCEM"
F24 "1.27mm x 1.27mm PCB Copper Area (SMD Test Point)" 0 -1805 50 H I L CNN "Part Description"
F24 "Plated Through Hole: Hole Dia.=2.7mm Pad Dia.=5.0mm" 0 -1805 50 H I L CNN "Part Description"
F25 " " 0 -1880 50 H I L CNN "Manufacturer"
F26 " " 0 -1955 50 H I L CNN "Manufacturer Part Number"
F27 "0mm" 0 -2030 50 H I L CNN "ComponentHeight"
......@@ -1751,10 +1751,10 @@ F32 " " 0 -2405 50 H I L CNN "ComponentLink1URL"
F33 " " 0 -2480 50 H I L CNN "ComponentLink1Description"
F34 " " 0 -2555 50 H I L CNN "ComponentLink2URL"
F35 " " 0 -2630 50 H I L CNN "ComponentLink2Description"
F36 "CERN DEM JLC" 0 -2705 50 H I L CNN "Author"
F37 "01/12/08 00:00:00" 0 -2780 50 H I L CNN "CreateDate"
F38 "01/12/08 00:00:00" 0 -2855 50 H I L CNN "LatestRevisionDate"
F39 "1.27mm x 1.27mm PCB Copper Area (SMD Test Point)" 0 -2930 50 H I L CNN "PackageDescription"
F36 "CERN DEM JMW" 0 -2705 50 H I L CNN "Author"
F37 "09/27/11 00:00:00" 0 -2780 50 H I L CNN "CreateDate"
F38 "09/27/11 00:00:00" 0 -2855 50 H I L CNN "LatestRevisionDate"
F39 "Plated Through Hole: Hole Dia.=2.7mm Pad Dia.=5.0mm" 0 -2930 50 H I L CNN "PackageDescription"
F40 "Eletro-mechanical" 0 -3005 50 H I L CNN "Database Table Name"
F41 "Pads" 0 -3080 50 H I L CNN "Library Name"
F42 "Pads" 0 -3155 50 H I L CNN "Footprint Library"
......
fieldbus.sch
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fmc.sch
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nanofip.sch
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power.sch
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