Double-check that lack of thermal reliefs won't cause tombstoning
The PolygonConnect_Power
rule removes thermal relief from most (or all?) power planes, leading to small (down to 0402) SMDs connected like the screenshot below. Can it be double-checked that this won't lead to tombstoning during assembly in production quantities? At the end it could be fine as 0402 may not be all that small after all, or using some non-eutectic solder paste may be already foreseen, but it would be great to verify that this has somehow been accounted for.