Review layout by BE-CO team
Question A) Add text: “https://www.ohwr.org/project/fmc-dio-10i-8o” so
that people can find the design files.
Answer A) Indeed, the link to the projects is missing. It will be added
on the top overlay.
B) Is the multi-pin connector not too far to the back?
B) The FCS8 will be placed as close as possible to the board edge.
C) Front-panel: Text marked “IC2 bus” -> “I2C bus”.
C) FP will have proper marking, along with TOP and BOT
D) Would the name on front panel be easier to read with fmc dio-10i-8o
instead of fmc dio10i8o? (Possibly the same on the PCB, on the Top
Overlay).
D) Most probably. If no other name than FMC DIO 10I8O, the suggested
separation will allow easier reading.
E) Why is 3D picture tilted? Ask it to be straight.
E) Indeed.
F) Is it nowadays possible to have a 3D pdf file (that one can rotate
from within an Adobe reader)?
F) It will be asked or done manually.
G) Do not mount TP1 and TP2 (both are visible: strange, in BOM TP1 is
mounted, TP2 not).
G) TP1 allows easy connection with GND, it will be mounted.
H) Some components are rather close to edge PCB (IC14, IC26, C22)
H) It will be changed according to the design office production
department.
I) Add text: “https://www.ohwr.org/project/fmc-dio-10i-8o” so that
people can find the design files.
I) See A)
J) What is pin near IC10? (the other end of TP1 or TP2?)
J) Yes, it is the other part of TP2
K) Is the multi-pin connector not too far to the back? I’m worried that if the front-panel is mounted, you cannot plug anything in. Could it not be moved to fit inside the front-panel? Make a prototype of front-panel before producing PCBs?
K) The entrance size will be larger, the FCS8 it is not too far on the back because its mate (FCF8) is reasonably long: http://suddendocs.samtec.com/prints/fcf8-xx-xx-x-xx.xx-s-x-mkt.pdf . The front panel could be made thinner also.
L) Most non-mounted components are to make the hysteresis? They really
need not to be mounted now? Possibly ask DEM to make a V1-1 with the
components for the hysteresis mounted.
L) It is on its way, there will be 2 executions
M) Bottom overlay: IC1E has text inside: NT1E. Remove this text.
M) Indeed, it does not belong here.
N) Possibly add markers for place of serial number sticker.
N) Good idea! It will be asked.
O) PCB drill page reads: “All vias 0.2mm hole diameter must be Filled
and Capped Holes.”. But it points only to the holes under ICs and not
“all 0.2mm vias” (which would be 878 holes).
O) Probably bad description, it should be written “all connected vias”,
it is in the attached .png
P) What does the **** point to for this line? “Filled and Capped Vias:
YES ****/*”
P) I must admit that I do not know, I am going to ask. I thought it was
some internal communication
Q) Text marked “IC2 bus” -> “I2C bus”
Q) See C)
R) Should there be a marker for pin 1, or top side of connector?
R) Yes, a mark should be present to facilitate possible debugging.
S) Take care of Asymetry” -> Asymmetry.
S) Changed.
T) Remove text: “This drawing may not be used …” and “Ce dessin ne peut
être …”. After all, it is Open Hardware. Add the CERN OHL text (same
as used on schematics).
T) Yes, it was added automatically this text. Changed.
U) Would the name be easier to read with fmc dio-10i-8o instead of fmc
dio10i8o? (Possibly the same on the PCB, on the Top Overlay)
U) See D)
V) Licence texts on each page mix V1.1 and V1.2 of CERN OHL version.
Make all V1.2. (note that each text should contain 3 times V1.2)
V) Changed.
W) LEDs on the front-panel are marked IN and OUT. Add to schematics
which one is IN and which one OUT.
W) Added to schematics, but it could be changed depending the need.
X) On page 6 is marked: “TCA9539 has been preferred”. But I don’t see
it, nor in the BOM.
X) The component arrived later than the rest, but has not been
implemented, hence the legacy. The text will be removed.
Y) Supervisor circuit MAX16043TG+. We’ve had some problems where we
suspect the supervisor circuit gave us troubles as it reset the rest of
the circuit in a hard-wired way. If yours may give similar problems, Is
it possible to switch off the supervisor part via the FMC
connector/FPGA?
Y) Sadly, the DAC requires the power supplies to be timed. It is not
possible to switch off this component with the FPGA.
Z) Is it correct that TCA6416APWR (page 6) VCCP is P3V3? Should it not
be P3V3AUX, like its power pins?
Z) Yes, it is deliberate in order to allow SCL/SDA to work properly in
case P3V3 is unpowered.
AA) On many places the signal names overlap the pin number of an IC
AA) It will be brush it up
BB) The three 4.7uF capacitors could not be replaced by 10uF of which
you already have 6?
BB) For the P7V0, there are 2 locations where a capacitor is required,
however it will exceed the recommended value for the regulators.
CC) Do not mount TP1 and TP2 (strange, in BOM TP1 Is mounted, TP2 not)
CC) See G)
DD) What about the TCA9539?
DD) See W)