V4 - Thermal relief pads of LEMO connectors too large
Feedback from INCAA:
Thermal relief pads J1-J5, pad spoke width on all 3 layers are 4 * 0.4
mm. This is not recommended for (wave-)solder process (IPC2221 &
IPC2222).
PAD diameter is 1.6 mm. thermal spoke width = (PAD diameter * 60 %) /
# spokes = 1,6 * 0.6 / 12 = 0.08 mm per spoke or less spokes.