EMC2-DP - PC/104 OneBank Carrier for SoC Modules.

Project description

The EMC2-DP is a PCIe/104 OneBank Carrier for a Trenz compatible SoC Module and has expansion for a VITA57.1 FMC LPC I/O board and also has I/O pins, using a 100-way Samtec RazorBeam connectors system.
The add-on board, called “Sundance External Interface Connector – SEIC” contains LEDs, RS232, USB2.0, HDMI, 1Gb Ethernet and SATA. The “SEIC” can be customized for individual applications and bespoke connectors.

The PCIe/104 OneBank design enables the EMC2-DP to be added to robust and rugged installations.

This development is made under the EU Artemis EMC2 project.

EMC2-DP production board*

Main Features

• PCIe/104 OneBank Carrier for Trenz 4x5cm SoC Modules

• PCI Express Gen 2 compatible and integrate PCI Express switch

• Infinite number of EMC2-DP can be stacked for large I/O solutions

• Expandable with any VITA57.1 FMC I/O Module for more flexibility

• 96 mm x 90 mm PC/104 Form-Factor with Cable-less Break-Out PCB Connector

• 8 electrical layers PCB

• Licensed under CERN OHL v.1.2

• Development made under the EU Artemis EMC2 project

Project information

• Block diagram (.pdf)
• Design Specification (.pdf)
• Starter Guide (.pdf)
• Pinout Compatibilities
  • Board IO (.pdf)
  • Master pinout (.xlsx)
  • Trenz pinout Viewer/XDC-Generator (.xlsm)

Hardware

• Schematics (created with OrCAD)
  • Schematics (.pdf)
  • Source files
• PCB (created with Zuken)

  • All layers (.pdf)

  • Gerber files

  • Source files

• Other
  • Board files
  • Constraints
  • STEP File
  • 3D PDF File

Software

• Demonstration examples
  • HDMI Output Test example SDSoC Platform (16.2) for z7030.
  • HDMI Loopback Test example

Contacts

Commercial producers

• EMC2-DP Sundance, United Kingdom

General question about project

• Ben Lovell - Sundance

Status

19 May 2017