[ General] Disable polygon connection (including thermals) to all BGA pads
This will likely cause the solder to not melt at all. For example:
- FMC connector pins j1, g1, e1, c1, a1, k2, k3
- IC18: L39, V39, Y39, AB39, A34, T39, A29, A24
This will likely cause the solder to not melt at all. For example: