Power dissipation Kintex UltraScale
The power dissipation is estimated as 17.6W in here: {{https://ohwr.org/project/diot-pfc-ku/blob/master/hw/power_estimation/UltraScale_XPE_2020_1.xlsm}} which results in a junction temperature of 86.7°C; on another sheet it is estimated to be 18.72W. For the chosen temeprature grade (Commercial, C) of the XCKU035-1FFVA1156C a maximum of 85°C is specified. Is it possible to change to the Extended, E or Industrial, I grades specifying up to 100/110°C? Besides that, I would nevertheless recommend to not operate the chip close to these limits, yet that I assume these estimateions have been done conservatively. Different guidelines recommend to operate at <=0.7*Tj,max. This is for reliability reasons to increase the margin between component strength and exposed stress in order to increase the lifetime. Therefore is it somehow possible to reduce this value? Cooling, firmware, etc?